ForschungPublikationen
Additive manufacturing of metal-bonded grinding tools

Additive manufacturing of metal-bonded grinding tools

Kategorien Zeitschriften/Aufsätze (reviewed)
Jahr 2020
Autoren Denkena, B., Krödel, A., Harmes, J., Kempf, F., Griemsmann, T., Hoff, C., Hermsdorf, J., Kaierle, S.:
Veröffentlicht in The International Journal of Advanced Manufacturing Technology, Vol. 107 (2020) 5-6, S. 2387-2395.
Beschreibung

Grinding tools with superabrasive grains can be manufactured from different bond materials. In several industrial applications, metallic bond systems are used. In general, these show good grain retention and offer a high thermal conductivity, when compared to the other widely used bond types such as vitrified and resin bonds. One drawback of the metallic bond is the lack of pores in the grinding layer. This is caused by the manufacturing processes that are typically used, like brazing or hot pressing. These generally produce very dense layers. The high density and low porosity lead to comparatively little space for the transport of lubricant, coolant, and chips. One approach to eliminate this disadvantage is to introduce cavities into the grinding layer, using the laser powder bed fusion technique (LPBF). In order to evaluate the general suitability of LPBF in combination with the bond material and diamond grains, grinding layer samples with a nickel-titanium bond were produced. The abrasive behavior of these samples was tested in scratch tests on cemented carbide to verify the applicability as grinding tools. While the diamond grains in the powder mixture are not part of the fusion process, they also did not interfere with the manufacturing process, and the scratch tests showed promising abrasive capabilities. The grinding layer itself withstood the process forces, and no grain breakout could be observed. This indicates that the grain retention forces are high enough for the grinding process and that NiTi has a high potential as a bonding material for the manufacturing of grinding tools via LPBF.

DOI 10.1007/s00170-020-05199-9