ForschungPublikationen
Sensory Workpieces for Process Monitoring –an Approach

Sensory Workpieces for Process Monitoring –an Approach

Kategorien Vortrag
Jahr 2016
Autoren Denkena, B., Dahlmann, D., Boujnah, H., Mücke, M.:
Veröffentlicht in 3rd International Conference on System-integrated Intelligence: New Challenges for Product and Production Engineering, SysInt 2016, 13. - 15.06.2016, Paderborn, 19 Seiten.