Feeling spindle for process force measurement in tool grinding

Kategorien Konferenz (reviewed)
Jahr 2023
Autorinnen/Autoren Denkena, B., Klemme, H., Buhl, H.:
Veröffentlicht in 15th International Conference & Exhibition, Lampamap (2023), 14.-15. March 2023, Edinburgh, UK, 10 Seiten.
Beschreibung

During tool grinding of workpieces with a large length-to-diameter ratio, process forces cause high deflections impairing the machining accuracy. To reduce such workpiece deflections, a support steady rest is commonly used. However, the support steady rest increases manual set-up effort, thereby decreasing productivity. In order to substitute the support steady rest, an innovative approach is to calculate the workpiece deflection by measuring the process forces using a compliance model. “Feeling” machine tools with structure-integrated force sensing capabilities are a promising approach to detect such process forces. In order to achieve high measurement accuracies when measuring the process forces, structure-integrated sensors must be placed close to the process. Therefore, a novel sensory grinding spindle is being developed for grinding of tools guiding the workpiece during machining. Sensors are integrated into the shaft, thereby enabling process force measurement during the tool grinding process. Equipped with semiconductor strain gauges and a contactless data transmission, the sensory spindle is able to measure the process forces acting on the workpiece and thus to provide force measurement data with high signal quality. With the introduced concept, forces with a resolution of higher than σ = 3.7 N were measured.

Datei 15032023_Buh_Feeling_spindle_for_process_force_measurement_in_tool_grinding__15th_International_Conference___Exhibition__Lampamap__2023_.pdf (PDF, 628 KB)