ForschungPublications
Porous metal bonds increase the resource effiency for Profile grinding

Porous metal bonds increase the resource effiency for Profile grinding

Categories Vortrag
Year 2018
Authors Denkena, B., Grove, T., Suntharakumaran, V.:
Published In 25th CIRP Life Cycle Engineering (LCE) Conference, 30.04. - 02.05.2018, Copenhagen, 14 Seiten.