Hockauf, R., Böß, V., Grove, T., Denkena, B.:
|Titel:||Prediction of Ground Surfaces by Using the Actual Tool Topography|
|Stichworte:||grinding; dexel-based kinematic simulation; surface prediction; grinding tool measurement; laser triangulation; envelope profile|
This paper presents a prediction model for ground surfaces that uses the actual grinding wheel topography to perform a grinding simulation. Precise knowledge of expected machined surfaces plays an important role in process planning. Here, the main criterion is the achievement of the components’ function after manufacturing. Therefore, it is essential to consider the surface roughness to enable a function-orientated workpiece surface. The presented approach uses a real grinding tool topography, which is measured by a 3D laser triangulation sensor in the machine tool. After a data processing step, the measured topography is imported into a material removal simulation. A kinematic simulation of the realistic ground surface enables the data-based confirmation of the envelope profile theory for the first time.